Is this the new SUPER PASTE for PCs?!

JayzTwoCents
28 Mar 202416:09

Summary

TLDRThe video explores the effectiveness of Slice Engineering Boron Nitride Thermal Paste, initially used for 3D printers, against Kingpin Extreme in a computer cooling context. Despite its high thermal conductivity rating of 31.8 watts per meter Kelvin, the paste's thin consistency led to suboptimal heat transfer in the test setup. The experiment highlighted the importance of using thermal pastes with appropriate viscosity and phase change properties for optimal heat management in different applications.

Takeaways

  • ๐Ÿงช The video discusses the testing of Slice Engineering Boron Nitride thermal paste, used for 3D printers and high-temperature applications.
  • ๐Ÿ”ฌ The thermal conductivity of materials is measured in watts per meter Kelvin, with the Kingpin Extreme having a rating of 13.8.
  • ๐ŸŽ๏ธ The Slice Engineering Boron Nitride paste has a high thermal conductivity of 31.8 watts per meter Kelvin, but becomes non-conductive at 100ยฐC.
  • ๐Ÿ’ง The paste is water-soluble, making it easy to clean up with rubbing alcohol, which is a useful property for maintenance and repairs.
  • ๐Ÿ”ฉ The video compares the performance of the new thermal paste with Kingpin Extreme, which is widely used and known for its ease of application.
  • ๐ŸŒก๏ธ The testing setup includes a locked voltage, frequency, and fan speeds to ensure consistent and fair comparison of the thermal pastes.
  • ๐Ÿ“ˆ The initial spike temperature is important for assessing the effectiveness of thermal paste in filling microscopic voids between the CPU and cooler.
  • ๐Ÿฅช The video uses the analogy of a cheeseburger layer to describe the different components involved in heat transfer from the CPU to the cooler.
  • ๐Ÿ› ๏ธ The application process of the Boron Nitride paste is found to be quite thin and watery, potentially leading to suboptimal heat transfer.
  • ๐Ÿงน Cleaning up the water-based paste is straightforward, but the video suggests that its properties may not be ideal for use between compressed metal surfaces.
  • ๐Ÿ“š The conclusion emphasizes the importance of using the appropriate thermal paste for the specific application to ensure optimal heat transfer and system performance.

Q & A

  • What is the primary purpose of thermal paste?

    -The primary purpose of thermal paste is to fill in microscopic voids and air pockets between the heat source (like a CPU die) and the cooler, thereby improving heat conduction and preventing thermal throttling.

  • How is thermal paste conductivity measured?

    -Thermal paste conductivity is measured in watts per meter Kelvin (W/mยทK), which indicates the material's ability to conduct heat relative to temperature change.

  • What are the key differences between Kingpin Extreme and Slice Engineering Boron Nitride thermal pastes?

    -Kingpin Extreme has a watts per meter Kelvin rating of 13.8, making it easy to apply and spread. In contrast, Slice Engineering Boron Nitride thermal paste has a significantly higher rating of 31.8 but becomes non-conductive once heated above 100ยฐC and is water-soluble for easy cleanup.

  • Why is it important to have a thermal material with the right consistency?

    -The right consistency ensures that the thermal material can effectively fill in the microscopic gaps between components without being squeezed out or becoming too thick, which could impede heat transfer.

  • What is the role of the IHS in a CPU cooler setup?

    -The Integrated Heat Spreader (IHS) is the metal part of the CPU that is responsible for transferring heat from the CPU die to the cooler. It is crucial for efficient heat dissipation.

  • What happens when thermal paste gets too hot?

    -When thermal paste gets too hot, such as above 100ยฐC, it can change its properties. For instance, the Boron Nitride paste becomes non-conductive and may also dry up, affecting its heat conduction capability.

  • How does the thermal paste application process impact its performance?

    -The application process is critical as an even and properly spread layer of paste ensures optimal heat transfer. Too much or too little paste, or an uneven spread, can reduce efficiency and lead to higher temperatures.

  • Why did the Boron Nitride thermal paste not perform as expected in the test?

    -The Boron Nitride thermal paste did not perform as expected because it was too watery and thin, causing it to be squeezed out from between the CPU and cooler, leading to suboptimal heat transfer.

  • What is the significance of the thermal interface material between the IHS and the cooler?

    -The thermal interface material between the IHS and the cooler is essential as it aids in transferring heat from the IHS to the cooler. If the material is of poor quality, it can create a bottleneck, leading to increased temperatures and potential thermal throttling.

  • How can you clean up thermal paste that is water-based?

    -Water-based thermal pastes can be cleaned up relatively easily using isopropyl alcohol. They tend to dry up and evaporate, allowing for quick and efficient cleanup.

  • What is the moral of the story from the video?

    -The moral of the story is to use the proper thermal paste for the intended application. Not all thermal pastes are created equal, and using the right one is crucial for optimal heat transfer and system performance.

Outlines

00:00

๐Ÿ”ง Introduction to Thermal Pastes and Conductivity

The video begins with an introduction to thermal pastes, focusing on a specific product - Slice Engineering Boron Nitride Paste. This paste is designed for 3D printers and high-temperature applications such as temperature probes and hotheads. The video aims to compare this paste with Kingpin Extreme, a popular choice for thermal conductivity. The script explains that thermal paste conductivity is measured in watts per meter Kelvin (W/mยทK), and provides a brief overview of the Kingpin Extreme's performance with a W/mยทK of 13.8. It also mentions the unique properties of the Boron Nitride Paste, which has a high W/mยทK rating of 31.8 but becomes non-conductive at 100ยฐC and is water-soluble for easy cleanup.

05:02

๐ŸŒก๏ธ Testing and Application of Thermal Pastes

The script continues with a detailed explanation of the testing process for thermal pastes. It describes the setup for measuring the initial spike in temperature and the importance of filling microscopic voids between the CPU and cooler with thermal paste to efficiently conduct heat. The video then presents the results of a test using Kingpin Extreme, showing a package temperature spike to 82-84ยฐC and a multicore score of 4,451. Following this, the script discusses the application of the Boron Nitride Paste, noting its water-based nature and ease of application. However, it also highlights issues with the paste's watery consistency, which may lead to it being squeezed out from under the cooler, potentially affecting performance.

10:02

๐Ÿ“‰ Analyzing Results and Thermal Paste Properties

In this section, the script analyzes the results of the thermal paste test, noting high temperatures and a drop in performance scores. It emphasizes the importance of efficient heat transfer from the CPU to the cooler and the potential bottleneck caused by suboptimal thermal interface material. The script also discusses the properties of the Boron Nitride Paste, suggesting that its watery consistency may not be suitable for CPU cooling due to its tendency to be squeezed out under pressure. It also touches on the phase change the paste undergoes when heated, turning from a liquid to a solid state.

15:03

๐Ÿšซ Conclusion on the Suitability of Boron Nitride Paste

The video concludes with a discussion on the suitability of the Boron Nitride Paste for computer cooling. Despite its high thermal conductivity rating, the paste's watery consistency and the issues with application lead to poor heat transfer results. The script reiterates the importance of using the correct thermal paste for the intended application and the need for a balance between thermal conductivity and physical consistency. It also reflects on the learning experience, acknowledging the complexity of materials science and the importance of using appropriate materials for specific applications.

Mindmap

Keywords

๐Ÿ’กThermal paste

Thermal paste is a compound used to fill the microscopic gaps between two surfaces, such as a CPU and its cooler, to improve heat transfer. In the video, the focus is on comparing different types of thermal pastes, specifically the Kingpin Extreme and a boron nitride paste by Slice Engineering, for their thermal conductivity properties.

๐Ÿ’กThermal conductivity

Thermal conductivity is a material property that describes its ability to conduct heat. It is measured in watts per meter Kelvin (W/mยทK) and indicates how effectively heat can be transferred through the material. In the context of the video, this property is critical for evaluating the performance of different thermal pastes.

๐Ÿ’กBoron nitride

Boron nitride is a compound used in the thermal paste discussed in the video. It is known for its high thermal conductivity and is specifically designed for applications like 3D printers where precise temperature control is necessary. However, it has a unique property of becoming non-conductive once heated above 100ยฐC.

๐Ÿ’ก3D printers

3D printers are manufacturing devices that create three-dimensional objects by successively adding layers of material. They require precise temperature control for the proper functioning of components like hotends and temperature probes, which is where specialized thermal pastes like boron nitride come into play.

๐Ÿ’กHeat conduction

Heat conduction is the transfer of thermal energy through a material without movement of the material itself. It is a fundamental process in thermal management, especially in electronics where efficient heat conduction away from heat-generating components is essential to prevent overheating and maintain performance.

๐Ÿ’กTemperature probes

Temperature probes are sensors used to measure the temperature of a system or environment. In the context of 3D printers, they are crucial for monitoring the temperature of the print head to ensure that materials like PLA or ABS are extruded at the correct temperatures for proper layer formation.

๐Ÿ’กWater-based

Water-based substances are those that primarily consist of water and are known for their ability to be easily cleaned with water or other solvents like isopropyl alcohol. In the context of the video, the boron nitride thermal paste is described as water-based, which affects its application and cleanup process.

๐Ÿ’กThermal throttling

Thermal throttling is a phenomenon where a device, typically a computer or its components, slows down its performance to reduce heat generation when temperatures reach certain thresholds. This is a safety measure to prevent damage due to overheating.

๐Ÿ’กCPU

A CPU (Central Processing Unit) is the primary component of a computer that performs most of the processing inside the computer. It is often referred to as the 'brain' of the computer. In the context of the video, the CPU is the heat-generating component that requires efficient cooling to function optimally.

๐Ÿ’กOverclocking

Overclocking is the practice of increasing the operating frequency of a component, such as a CPU, beyond the manufacturer's specified limits to achieve higher performance. This often results in increased heat generation and requires effective cooling solutions to manage the additional heat.

๐Ÿ’กAIO cooler

An AIO (All-In-One) cooler is a type of liquid cooling system that comes pre-assembled with a water block, radiator, pump, and fans. It is used to dissipate heat from components like CPUs by circulating coolant through the system, thereby providing effective cooling.

Highlights

The discussion focuses on comparing Slice Engineering Boron Nitride Paste with Kingpin Extreme, two thermal pastes with different applications.

Thermal paste conductivity is measured in watts per meter Kelvin, a critical factor when comparing different pastes.

Kingpin Extreme has a watts per meter Kelvin of 13.8, making it a widely used thermal paste for general applications.

Slice Engineering Boron Nitride Paste has an impressively high watts per meter Kelvin of 31.8, indicating superior heat conduction potential.

The Boron Nitride Paste becomes non-conductive once heated up to 100 C, which is a unique characteristic for specific applications.

The experiment includes a controlled environment with a locked voltage, frequency, and fan speeds to ensure accurate thermal paste comparison.

The initial spike temperature is crucial for assessing the thermal paste's effectiveness in filling microscopic voids between the CPU and cooler.

The testing procedure involves a 10-minute test to observe the maximum temperature reached, providing insights into the thermal paste's long-term performance.

The importance of the thermal interface material is emphasized, as it prevents heat bottlenecks and contributes to maintaining optimal CPU performance.

The experiment results show that the Kingpin Extreme paste led to package temperatures in the low to mid-80s, with a peak of 84-85 degrees.

The Boron Nitride Paste's application revealed it to be much thinner than expected, which could affect its performance when compressed between CPU and cooler.

Despite its high conductivity rating, the Boron Nitride Paste underperformed in the test, possibly due to its watery consistency and tendency to be squeezed out.

The cleanup process for the water-based Boron Nitride Paste is easy, using isopropyl alcohol to remove residue.

The conclusion emphasizes the importance of using the appropriate thermal paste for specific applications, as not all pastes are equal.

The video serves as an educational resource, demonstrating the practical application and testing of thermal pastes in real-world scenarios.

The experiment's design and findings highlight the significance of thermal conductivity in maintaining CPU performance and the role of thermal paste.

The video content is a response to a viewer's request, showcasing the practical examination of Slice Engineering Boron Nitride Paste.

Transcripts

00:00

today we're going to talk about thermal

00:01

paste because I was kind of sent by a

00:03

viewer uh something that they wanted me

00:05

to check and that is specifically this

00:07

slice engineering uh boron nitride paste

00:10

which is specifically used for 3D

00:12

printers and like their temperature

00:14

probes and hotheads and stuff for things

00:17

that need to conduct heat there so we're

00:19

going to compare it to the Kingpin

00:22

extreme because when we talk about

00:24

thermop paste conductivity it's kind of

00:26

nuts what this is capable of we're going

00:28

to see whether or not it even makes a

00:29

difference for

00:31

computers today's video is brought to

00:32

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00:35

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00:36

paying tribute to one of the best

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00:43

cramp so when it comes to measuring

00:45

thermal paast conductivity it's done in

00:47

a formula called watts per meter Kelvin

00:50

so we're not going to go into the

00:50

formula equation as to what that

00:52

actually means but that is when we're

00:54

comparing Pace conductivity that's the

00:56

number referenced so to put this into

00:58

perspective the kpx or the Kingpin

01:00

extreme which I use pretty much

01:01

everywhere oh by the way it's like

01:04

you her best

01:06

friend don't worry about that guy he's

01:10

only there on the weekends anyway moving

01:12

on um I'm glad she's wearing headphones

01:14

back there so kpx which is something

01:16

I've been using for a long time mostly

01:18

because of how easy it is to actually

01:19

apply this paste it's not too thick it's

01:21

not too liquidy it's kind of perfect

01:23

right in the middle terms of goldilock

01:24

it's like the just right porridge you

01:26

can easily apply it and spread it and

01:28

don't have to warm it up first or

01:29

anything like that it's got a watts per

01:31

meter Kelvin um of

01:34

13.8 so there you go so when it comes to

01:37

the thermal Grizzly the little bitty guy

01:40

little gam this is like what you would

01:42

get with like an AO cooler or something

01:44

like that you

01:45

can you can get bigger it's under the

01:47

table now you can get bigger tubes if

01:49

you want um but that's just one gram and

01:52

we'll talk about that in a sec because

01:53

that is

01:54

12.5 uh watts per meter Kelvin so

01:57

already uh lower than the kpx right this

02:00

is 13.8 the slice engineering boron

02:03

nitride thermal paste is

02:07

31.8 yeah

02:09

31.8 it is extremely high um there's

02:13

also something to point out though is

02:15

it's got very low conductivity and it

02:16

becomes non-conductive once it's heated

02:18

up to 100 C so there might be a slight

02:22

amount of conductivity to this it's also

02:24

actually like water soluble like it's it

02:27

dilutes in water nicely so it's easy to

02:29

clean up especially with rubbing alcohol

02:30

and stuff I'm not too concerned about

02:32

this having a slight amount of

02:33

conductivity I bet you I could put it on

02:35

stuff and would be fine it's just they

02:37

do they are upfront and saying that it

02:39

is not fully non-conductive until it's

02:41

been heated up to 100 C it's easy to do

02:43

that these days just let any motherboard

02:45

take any 14 series CPU to its Intel

02:49

limits being removed and there you go

02:52

there's your 100 C so yeah I know that's

02:54

the die temp but that will transfer to

02:56

as well if you let it run long enough so

02:58

I've got kpx pre-installed installed

03:00

right now and I've done some perimeters

03:02

here to sort of lock down our testing

03:04

I've got a 13900 K I've got my voltage

03:06

locked I've got my frequencies locked

03:09

I've got my fan speeds and my pump

03:11

speeds locked so everything is just

03:14

completely level it won't dynamically

03:16

adjust or change we also have the

03:18

temperature in this room stuck to 70ยฐ

03:21

fah so it's less important on what those

03:23

numbers are as compared to what is the

03:26

before and after test so one of the

03:28

things I want to check right now to is

03:29

what the initial Spike temperature is

03:32

because one of the the first line of

03:34

defense of your cooler being able to do

03:36

its job is the fact that you have to

03:37

have a thermal material in between the

03:40

IHS and the cooler filling in all those

03:42

microscopic voids and air pockets that

03:44

will form and that's what thermal paste

03:46

does is it fills those voids and it

03:48

conducts that heat because we all know

03:50

air is a terrible terrible conductor of

03:52

heat so that's why we need to make sure

03:54

that we have paste in there so

03:56

theoretically a a paste that has a

03:58

higher conductivity should more

04:00

efficiently move that heat from the heat

04:02

Source in this case which is the diey to

04:05

the cooler now there's a couple layers

04:07

there like a there's like a cheeseburger

04:08

layer yeah the fact guy talking about

04:09

cheeseburgers and is it lunch time yet

04:11

okay I digress it there's like a there's

04:12

like a Big Mac happening here when it

04:14

comes to different layers you have your

04:16

dye which is the actual silicon

04:18

substrate or not the substrate but the

04:19

Silicon itself on the substrate then you

04:21

have the thermal interface material in

04:24

the 1300 K instance it's like a soldered

04:27

Tim it's like it's like a soldered paste

04:29

it's not quite soldered it's something

04:31

they put in there and they heat from the

04:32

outside and then it solidifies so that

04:35

is moving material from the die to the

04:36

IHS now the IHS is that metal thing that

04:39

when you look at the CPU that has all

04:40

the printing and numbers and stuff on it

04:42

that is responsible for now touching the

04:45

cooler but now you have the material

04:47

between the IHS and your cooler which is

04:48

the thermal interface material so there

04:51

there we might be moving some of that

04:53

efficiencies around based on how good or

04:55

how bad it is so if you have terrible

04:57

thermal interface material all that heat

04:59

is going to have a bottleneck at the

05:01

thermal interface material which means

05:02

it'll build up at the die and then your

05:04

clocks slow down your voltages go down

05:05

and your computer starts to slow down

05:07

because of thermal throttling so we want

05:09

to make sure that that heat can get out

05:11

of the entire CPU array of Big Mac Patty

05:14

whac give your dog a bone whatever I

05:16

don't know why I went there having a bit

05:18

of a day let's just go with it okay we

05:19

want to make sure we get that heat to

05:21

the cooler as fast as possible we don't

05:22

want a thermal past to be what's holding

05:24

us back I don't care about the scores so

05:26

much unless we start slowing down on our

05:28

CPU so the package is currently sitting

05:30

at 33c so I'm just going to do a single

05:33

run First of multicore and let's see

05:35

what we Spike up to so it's 82

05:37

84 on the package you can see our cores

05:40

are sitting the PE cores are low 80s mid

05:42

80s a couple in the high 70s mid 70s 83

05:46

84 it's actually pretty good we drooped

05:49

down to 1.78 or 1. 285 or so on the vid

05:53

that's normal CU we do have a droop

05:55

enabled um they give us a score of a

05:58

4,451 what I'm going to do now is I'm

06:00

going to do a 10minute test because I

06:04

want to see what our Max temperature is

06:05

going to be as well because

06:07

theoretically we should not see that

06:09

number necessarily go up too much higher

06:12

than a few degrees cuz keep in mind we

06:13

do have a 360 aiio as that water

06:15

temperature gets warmer we're going to

06:16

see the temps climb too because the

06:18

thermal capacity of the water is

06:19

becoming more saturated with the heat

06:21

that it's exchanging that's why I have

06:23

my fan set to

06:25

75% static speed instead of 100 uh just

06:29

because for noise for the video honestly

06:30

but 75% on this AIO should be plenty

06:33

with these varar fans and then um we'll

06:36

see what our Max temperature ceilings at

06:38

change the thermal paste we'll take you

06:40

along for the ride of application I've

06:41

not opened one of these yet I bought

06:43

three of them by the way I got them on

06:44

Amazon and I want to see how easy it is

06:48

to apply and spread cuz it is

06:49

water-based it should be very similar to

06:52

The Kingpin where it should be easy to

06:54

apply and for the Kingpin I did not

06:56

pre-s spread I just did a line down the

06:58

very center of the CPU

07:00

so we want to see how it spreads as well

07:02

okay so our package is at 93 currently

07:04

in this part of the test looks like it's

07:05

spiked 94 at least once that was and our

07:09

cores are sitting here in the upper 80s

07:12

so we've only got 8 seconds left on this

07:14

test and then um we'll see our package

07:17

wattage actually went up to 310 cuz what

07:19

you may not realize is as temperature

07:21

goes up so can power draw um our vid is

07:24

still around the same at

07:26

1.27 1.28 so that's why our power ended

07:29

up going going up or at least our

07:30

wattage because as temperature goes up

07:32

it becomes more inefficient which means

07:33

more power to end up maintaining those

07:35

clock speeds and stuff and because we

07:37

removed all those limits is why we

07:38

didn't lose any clock speed it actually

07:39

stayed at the 5 um 7 GHz all core or 5.6

07:44

GHz all core uh and we're at 6.1 single

07:47

core right now so my overclock is

07:49

apparently doing really well for a down

07:50

and dirty didn't really try Okay so

07:52

these are what our numbers looked like

07:54

here um I guess what we're looking for

07:56

now is is it going to be any different

07:58

at all because 92 to 93c is what we were

08:02

seeing on average right there after 10

08:04

minutes our cooler was fully saturated I

08:06

need to let it cool down right now you

08:08

can see our score dropped about 1,000

08:09

points as well that's typical as well

08:11

with high heat U even though our clock

08:13

speeds didn't change they might be

08:15

changing very quickly faster than the

08:17

the polling rate of the software is

08:19

where it might be come downclocking and

08:21

clocking back up so quickly that it not

08:22

picked up in the pulling rate which is

08:24

what will end up affecting our score all

08:26

right so letting it cool down we'll

08:29

apply the Boron the the boron nitride

08:32

and we'll see if this is going to be a

08:33

suitable solution um for an inexpensive

08:37

thermal paste that's that's the teaser

08:39

here that's also why I had that little

08:40

tube okay so let's see how easy it is to

08:43

actually

08:44

apply okay that's a little fleeky so

08:48

let's try this on a paper towel real

08:49

quick oh okay it really squishes

08:52

out jeez hold on okay so I'm going try

08:56

and apply this about the same way I did

08:59

the

09:00

kpx this is actually quite a bit thinner

09:04

than I was

09:05

expecting there I put a lot cuz I don't

09:08

want to I need to be careful with the

09:10

squish out because of the fact that it

09:12

needs to be hot to not be thermally

09:16

conductive you mean electrically

09:18

electrically conductive yes we want

09:19

thermal conductivity we don't want

09:20

electrical conductivity okay so

09:23

theoretically if it squished out it

09:26

still should not have killed my computer

09:28

if it did

09:30

oops there we

09:34

go I forgot to plug in the

09:37

pump okay we got it to 100

09:40

C look how fast I came down okay so I

09:43

was like uhoh it's at 100 C already cuz

09:46

I forgot to plug in the pump guess what

09:49

I think we made we did the dehydration

09:52

process on accident

09:55

oops I was wondering how am I going to

09:57

how am I going to make it hit 100 C like

09:58

should I go with crazy overclock no

10:00

forget to plug in your pump that'll do

10:02

it okay let's clear those Min Maxes Pro

10:05

tip if you want the throttle unplug your

10:07

phum just one run what do we got right

10:09

now so right 61 65 68 92 93 94 96 for in

10:18

' 90s on all the course we did have our

10:20

full score of 4,456 but that's only

10:22

because we have nothing in place to make

10:25

it do any sort of dynamic throttling

10:27

until it hits 100t this tells me right

10:30

now we have uh pretty poor conductivity

10:34

and I don't think that's going to be

10:35

anything to do with the thermal paste

10:38

itself I honestly think that might have

10:40

to do with how watery it is I think a

10:42

lot of it just smooshed out the side I

10:45

really think that that's what the

10:46

problem is there so let's do that again

10:49

I won't do the 10-minute test at those

10:51

temperatures cuz it's

10:52

just 94 96

10:56

97 yeah 39 827 it came down okay so with

11:01

that said let's go

11:04

ahead and shut this down and let's take

11:06

off the pump and let's see what the

11:09

thermal paste looks like because I have

11:11

a feeling it's so watery and so thin

11:13

that as soon as I tighten it down it

11:15

just smooshed out like I feel like we

11:17

need some of that

11:19

thickness to be able to maintain its

11:22

position between the two surfaces cuz

11:25

typically what you're doing with this

11:26

stuff here is you're taking it and your

11:29

putting it on like thermal couplers or

11:31

thermal probe kind of deals and you're

11:34

just gooping it all over it and then

11:35

you're sticking it like in a hole that's

11:37

reading temperatures of like the print

11:39

head and stuff cuz remember 30 printers

11:41

have to be able to monitor the

11:41

temperature like it has to know what the

11:43

temperature the print head and stuff is

11:44

that way it can monitor when you set you

11:46

know pla or whatever it's at 200

11:48

whatever C or it has to know what those

11:50

temperatures are so all this you can

11:52

just fill that whole void with the white

11:54

stuff and then it's conducting and

11:58

sending it back but it's not having to

11:59

do it between two pieces of compressed

12:02

metal at this point so I have a feeling

12:04

that all squished out which means I now

12:05

have cleanup to

12:08

do actually no it didn't not not as much

12:11

as I thought it would but you can see

12:13

right there with how liquid liquidy it

12:15

is it created these like veins which are

12:18

really interesting looking I have a

12:20

feeling the veins that are left on the

12:21

IHS will match up with the low spots and

12:24

the high spots here will match up with

12:25

those low spots but clearly it was not

12:28

transfer heat like if we had thermal

12:30

paste that looked like that we

12:31

definitely wouldn't have had the we

12:32

wouldn't have had the best performance

12:34

but we would not have seen the instant

12:36

temperatures that we saw in this case so

12:39

now let's see how well it cleans

12:42

up since it's waterbased it should work

12:45

pretty well with isopropyl

12:48

alcohol just like wipes right off wow it

12:51

looks like Elmer's

12:54

Glue like I still have to take it out I

12:56

think to get that cleaned up perfectly

12:58

but uh yeah well that's too bad I was

13:02

exp I was hoping that we would see some

13:04

good results out of this because 5 cc's

13:06

of this was $12.99 from uh Amazon and

13:11

that brings it down to like $260 a gram

13:14

whereas like the thermal Grizzly was

13:16

like $8.99 a gram that's what that

13:19

little tube was but

13:21

clearly not all thermal paste types are

13:25

created equal all right so it's all

13:27

cleaned up I had to take the CP PE out

13:29

cuz it definitely got in there little

13:31

big out on the pins but I was able to

13:33

just kind of take care of that with some

13:34

alcohol fortunately because it's

13:35

water-based it's nice that it just dries

13:37

it up and evaporates it so um I want to

13:40

now we're back on kpx I wanted to just

13:42

do a sanity check to make sure

13:43

everything's running as it should so if

13:46

I hit multicore go should spike in the

13:48

mid

13:50

80s 84 83 85 exactly where it was before

13:55

so I think it said it was like between

13:56

84 and 86 there it is 84 and 6 so there

14:00

we go imagine chemists knowing more than

14:03

some average fat

14:05

YouTuber so look the difference is every

14:09

thermal paste is made up of a couple of

14:11

different um materials in there there's

14:14

whatever the actual conductive material

14:16

is whether it be metal or ceramic or um

14:20

crystals in this case the Boron nitrate

14:21

it's crystals so there's also the the

14:24

suspension material how is that how is

14:26

that Crystal being like applied right so

14:29

this one was actually very watery it's

14:31

very water-based obviously the chemists

14:34

that have created thermal paste for

14:35

computers have figured out the right

14:37

consistency where it's not too thin when

14:39

hot but not too thick when cold there's

14:40

there's a whole process to that clearly

14:43

because of the application that the

14:45

Boron nitrites being used in for 3D

14:46

printing it's a completely different

14:48

type of application like I've already

14:49

said it's not having to deal with

14:50

pressures of components pushing against